CASE
SIZE |
PDF - SPEC |
TYPE |
DESC |
Performance
Data |
0201
0402
0603 |
NMC-Q |
 |
MLCCs - Multilayer
Ceramic Chip Capacitors
• Stable NPO (COG)
• High Q &
Low ESR
• For use up to 3GHz
• Sample Kits |
ê
|
| NMC-L |
|
NMC-M |
0201
0402
0603 |
NTI |
 |
Thin Film Chip Inductors
•
1.0nH ~ 100nH
• Precision Tolerance
±0.1nH (B), 1% (F) & 2% (G)
• High Q & SRF
•
Low DCR & High DCI
• 0.23 ~ 0.45 mm height |
 |
0403
0504
0703
1006 |
NLA |
|
SMT Air Core Chip Inductors
• 2.5nH ~ 538nH ±5% ±10%
• High Q; up to 87
• SRF to 12.5Ghz
• 4A DCI
• -40°C ~ +125°C
|
|
0201
0402
0603 |
NML |
 |
Multilayer Chip Inductors,
• Ceramic Body
• Designed for High Frequency Applications
• High Q and SRF Characteristics
• Tight Tolerance D (0.3nH) and J ( 5%) |
ê
|
0805
0806
1008 |
NFP |
|
Multilayer Power Inductors
Ferrite Chip Power Inductors
•
High Current / Low DCR
• 0.47µH ~ 4.7µH
• 0.5mm to 1.1mm height
|
|
0603 0805
1206 |
NFI |
 |
Multilayer Chip Inductors
•
Ferrite Body
• Wide Range - Low Cost
• Magnetically Shielded
• 0.047μH ~ 33μH |
|
0402
0603 |
NIS |
 |
Spiral Cut Chip Inductors
• High Q & SRF
• RF - Wireless Applications
• Precision Tolerance
•D ± 0.3nH, G ± 2% or J ± 5% |
ê
|
0402
0603
0805
1008 |
NIN-H |
 |
Wire-wound Open Frame Chip Inductors
•
High SRF
• High DCI
• High Q
• High L in small sizes |
ê
|
0805
1008
1210
1812 |
NIN |
 |
Wire-wound Molded Case Chip Inductors
•
High SRF
•
High DCI
• High L in small sizes |
0805
1008
1206
1210
1812 |
NLQ |
 |
Wire-wound Open Frame Chip Inductors
•
High SRF
• High Inductance
•
High DCI |
|
0805
1206 |
NCC |
 |
Miniature Common Mode Choke
•
USB & IEEE Interface
• High Common Mode Z
• Low profile SMT |
|
0201
0402
0603
0805
1206
1210
1806
1812 |
NCB |
 |
Ferrite Chip Beads
•
High Impedance
• High DCI,
Low DCR
• EM/RFI Suppression up to 1Ghz
• Current Ratings to 900mA |
ê
|
0402
0603
0805
1206
1210
1806
1812
1612
3312
3119 |
NCB-H |
 |
High Current Ferrite Chip Beads
•
High Impedance
• Higher DCI
• Reduced DCR
• EM/RFI Suppression up to 1Ghz
• Current Ratings to 6A (6000mA) |
ê
|
