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NIC Components Corp. your global
source for RF Passive Components. Low cost multi-technology components designed for today's RF applications and tomorrow's emerging wireless data-comm and telecom technologies.

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    FREE » Samples | Quick Kit | PD = Performance Data

    SIZE

    		 PDF - SPEC

    TYPE

    		  DESC

    PD

    0201
    0402
    0603

    		 NMC-L
    NMC-M

    		MLCCs - Multilayer Ceramic Chip Capacitors Stable NPO Dielectric, High Q, Low ESR

    0603
    0805
    1206

    		 NMF

    		EMI Filter: 3-Terminal Ceramic Chip Capacitor 0603, 0805, 1206  

    0201
    0402
    0603

    		 NTL

    		Thin Film Chip Inductors
    Precision Tolerance, High Q, High DCI
    Low DCR, Low Profile and Low Cost

    0402
    0603

    		 NML

    		Multilayer Chip Inductors,
    Ceramic Body, Stable, High Q, Low DCR

    0603 | 0805
    1008 | 1206
    1210 |1812 

    		NFI

    		Multilayer Chip Inductors
    Ferrite Body, Wide Range - Low Cost

    0201
    0402
    0603

    		 NIS

     

    		 Spiral Cut Chip Inductors
    High Q, High SRF, Tight Tolerance 

    0402 | 0603
    0805 | 1008

    		 NIN-H

    		Wire-wound Open Frame Chip Inductors
    High SRF, High DCI

    1008
    1210
    1812

    		 NIN

    		Wire-wound Molded Case Chip Inductors
    High SRF, High Inductance, High DCI

    0805
    1008 | 1206
    1210 | 1212
    1812

    		 NLQ

    		Wire-wound Open Frame Chip Inductors
    High SRF, High Inductance, High DCI

    0805
    1206

    		NCC

    		Miniature Common Mode Choke
    USB & IEEE Interface
    High Common Mode Impedance

    0402
    0603 | 0805
    1206 | 1210
    1812

    		 NCB

    		Multilayer Flat Chip Ferrite Chip Beads
    High Impedance, High DCI, Low DCR
    EMI Suppression

    1612
    3312
    3119

    		 NCB-H

    		Multilayer Flat Chip Ferrite Chip Beads
    High Current, Low DCR
    EMI Suppression
    0404 NFA

    Thick Film Chip Attenuator
    0.5 ~ 20.0db DC ~ 3GHz,
    Small 1.0 x 1.0mm Size
     

     

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     RF, high frequency, wireless, passive components, high q, high SRF, rf capacitors, chip inductors, ferrite chip, wirewound, SRF, NPO, low ESR, EMI, RFI, Wireless, WLANs, HiperLAN, 802.11a, 802.11b, Wi-Fi, Bluetooth, Telematics, PCS, LMDS, Cellular, MLCC, MLI, DCR, DCI