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CASE
SIZE

PDF - SPEC

TYPE

 DESC

Performance
Data

0201
0402
0603


NMC-Q

MLCCs - Multilayer
Ceramic Chip Capacitors

• Stable NPO (COG)
• High Q & Low ESR
• For use up to 3GHz

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NMC-L
NMC-M

0201
0402
0603

NML

Multilayer Chip Inductors,
• Ceramic Body
• Designed for High Frequency Applications
• High Q and SRF Characteristics
• Tight Tolerance D (0.3nH) and J ( 5%)

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0603 0805
1206

NFI

Multilayer Chip Inductors
• Ferrite Body
• Wide Range - Low Cost
• Magnetically Shielded
• 0.047μH ~ 33μH

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0402
0603

NIS

 

Spiral Cut Chip Inductors
• High Q & SRF for RF - Wireless Applications
• Precision Tolerance (D ± 0.3nH, G ± 2% or J ± 5%)
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0402 0603
0805 1008

NIN-H

Wire-wound Open Frame Chip Inductors
• High SRF
• High DCI
• High Q
• High L in small sizes
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0805
1008
1210
1812

NIN

Wire-wound Molded Case Chip Inductors
• High SRF
• High DCI
• High L in small sizes

0805
1008
1206
1210
1812

NLQ

Wire-wound Open Frame Chip Inductors
• High SRF
• High Inductance
• High DCI

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0805
1206

NCC

Miniature Common Mode Choke
• USB & IEEE Interface
• High Common Mode Z
• Low profile SMT

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0201
0402
0603
0805
1206
1210
1806
1812

NCB

Multilayer Flat Chip Ferrite Chip Beads
• High Impedance
• High DCI, Low DCR
• EM/RFI Suppression up to 1Ghz
• Current Ratings to 900mA
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0402
0603
0805
1206
1210
1806
1812
1612
3312
3119

NCB-H

Multilayer Flat Chip Ferrite Chip Beads
• High Impedance
• Higher DCI
• Reduced DCR
• EM/RFI Suppression up to 1Ghz
• Current Ratings to 6A (6000mA)
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