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CASE
SIZE

PDF - SPEC

TYPE

 DESC

Performance
Data

0201
0402
0603


NMC-Q

MLCCs - Multilayer
Ceramic Chip Capacitors

Stable NPO (COG)
High Q & Low ESR
For use up to 3GHz


NMC-L
NMC-M

0201
0402
0603

NML

Multilayer Chip Inductors,
Ceramic Body
Designed for High Frequency Applications
High Q and SRF Characteristics
Tight Tolerance D (0.3nH) and J ( 5%)


0603 0805
1206

NFI

Multilayer Chip Inductors
Ferrite Body
Wide Range - Low Cost
Magnetically Shielded
0.047μH ~ 33μH


0402
0603

NIS

 

Spiral Cut Chip Inductors
High Q & SRF for RF - Wireless Applications
Precision Tolerance (D 0.3nH, G 2% or J 5%)

0402 0603
0805 1008

NIN-H

Wire-wound Open Frame Chip Inductors
High SRF
High DCI
High Q
High L in small sizes

0805
1008
1210
1812

NIN

Wire-wound Molded Case Chip Inductors
High SRF
High DCI
High L in small sizes

0805
1008
1206
1210
1812

NLQ

Wire-wound Open Frame Chip Inductors
High SRF
High Inductance
High DCI


0805
1206

NCC

Miniature Common Mode Choke
USB & IEEE Interface
High Common Mode Z
Low profile SMT


0201
0402
0603
0805
1206
1210
1806
1812

NCB

Multilayer Flat Chip Ferrite Chip Beads
High Impedance
High DCI, Low DCR
EM/RFI Suppression up to 1Ghz
Current Ratings to 900mA

0402
0603
0805
1206
1210
1806
1812
1612
3312
3119

NCB-H

Multilayer Flat Chip Ferrite Chip Beads
High Impedance
Higher DCI
Reduced DCR
EM/RFI Suppression up to 1Ghz
Current Ratings to 6A (6000mA)


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